Technology

...joining the impossible

Our Technology

Strong & Versatile Bonding

AdherAlloy™ solders efficiently bond challenging substrates including specialty metals, carbide, nitride and oxide ceramics, glasses, even diamond.

These solders bond directly to materials like:

Optical materials (SiO₂, LiNbO₃, ZnSe, YAG)

Semiconductors (Si, GaAs, GaN, SiC)

Diffusion barriers (TiN, TaN)
Dielectrics (SiO2, Ta₂O₅, Si₃N₄, Al₂O₃)

Heat Sinks (diamond, AlN, SiC)

Carbides(WC, SiC)

Metals (Al, Cu, Stainless Steel, NiTi, Tungsten, Ti, Invar, Ni, Gold, Si)

Gem stones (Sapphire, Topaz, Diamond)

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The Science Behind the Magic

Adhera's active solders combine base metals with rare-earth elements in a patented formulation to create nanodisperse intermetallic oxygen-scavenging phases(labeled "A" in the figure). These active phases chemically attack surface oxide and other barriers, enhancing both fast wetting and ultimate bonding. In many processes, little or no mechanical energy is required to cut through interfering surface layers. In others, minimal shear, compression or ultrasonic action will suffice. Further, these alloys create interfacial bonds that are thermodynamically stable and remain so indefinitely, ensuring bond reliability even under extremes of temperature, vibration and other challenges.

Download a journal article.